Leica Precision Grinding Integrated Machine EM TXP target surface preparation system has the function of fixed-point trimming and polishing. After sawing, grinding, milling and polishing the sample, it is used for electron microscope (TEM Transmission electron microscopy and SEM Scanning electron microscope), LM (optical microscope), Confocal microscopy and AFM (Atomic force microscopy) inspection.
Equipped with an integrated mirror for accurate positioning and observation during sample processing of subtle and difficult to observe target positions; By using the sample rotation handle, the observation angle of the sample can be changed, adjustable from 0 ° to 60 °, or observed perpendicular to the front surface of the sample at 90 °. The distance can be measured using an eyepiece scale.
Integrated automatic program control, including automatic left and right braking mechanism, forward feedback force control, countdown function, etc., saves a lot of time for users.
Surface treatment and object detection are both completed through an integrated stereoscope, and users do not need to specifically take out samples for surface observation and detection, which can greatly improve their work efficiency.
Suitable for a variety of tools, allowing samples to be ground, cut, drilled, ground, and polished without transfer. And the entire processing process can be observed and monitored through a stereoscope, greatly saving time and cost.